This product was developed to achieve a drastic reduction in voiding in components with a large contact surface, such as power transistors, QFNs and, above all, automated applications. Anti-cushion effect formula. Powerful wetting. Guarantees consistent quality and performance during long-term use over several days. Very economical in its application. Halogen-free. The solder paste is suitable for superfine applications, MBGA, 0.4mmP QFP and QFN.

Today, the number of applications and types of PCB available for SMT have increased. The soldering conditions are adapted to suit the different surfaces and the quality of the base metal. Oxidised components are a huge problem as they cause a wide range of soldering defects. Ensures outstanding continual printability with super-fine pitch (0.4 mm/16 mil) and CSP applications (>0.3 mm dia.) for normal to fast printing and a long stencil lifetime. Powerful wetting of oxidised base plates and components, such as oxidised nickel. Ultimate solution for dewetting.

Solder alloy with low melting point (138°C). Replacing the SnAgCu alloy with this product can reduce C02 emissions by up to 40% thanks to the low melting point. Outstanding wetting and low voiding. Halogen-free (Br ≤ 900 ppm, Cl ≤ 900 ppm, Br + CI ≤ 1500 ppm). TB48-M742D is suitable for dosing systems.