Stencil cleaning

VIGON SC200

Stencil cleaner for the removal of solder pastes and SMT adhesives

VIGON® SC 200 is a water-based cleaning agent designed to clean SMT stencils at room temperature. The cleaning agent reliably removes solder pastes and SMT adhesives in one single process and can also be used for stencil underside wiping in printers.

High bath loading capability, very good filterability and therefore a long bath life as well as low maintenance costs
Recommended for ambient cleaning temperatures
Water-based cleaner without flash point, no explosion-proof protection required
Due to its mild formula, the medium shows excellent material compatibility with stencils
Applicable in closed-loop systems
No foaming when used in spray-in-air systems
Low odor, no building of organics in the rinsing section

VIGON SC202

For the removal of solder pastes, SMT adhesives and fluxes

VIGON® SC 202 is a water-based cleaning agent designed for the reliable removal of solder pastes and SMT adhesives from stencils. Based on the MPC® Technology, this medium has also been developed to clean double-sided misprints, with one side already soldered. The cleaning agent is recommended to be used in spray-in-air and ultrasonic cleaning systems.

Specifically developed for the removal of fluxes from double-sided misprinted boards with one side already soldered
High bath loading capability, excellent filterability and therefore a long bath life as well as reduced cleaning costs
This water-based cleaner is surfactant-free and can easily be rinsed without leaving any residues
Has no flash point and can be used without explosion-proof protection
The cleaner can be used in spray-in-air systems and ultrasonic dip tanks
No foaming when used in spray-in-air systems, low odor

VIGON SC210

For the removal of solder pastes and SMT adhesives

VIGON®SC 210 is a water-based cleaning agent specifically developed to clean SMT stencils. The cleaning agent reliably removes solder pastes and SMT adhesives in a single process and provides optimum cleaning results even at low temperatures starting from 18°C/64°F. VIGON®SC 210 is designed to be used in spray-in-air and ultrasonic cleaning systems.

Shows constantly good cleaning results at temperatures between 18-40°C/64-104°F
Water-based, surfactant-free cleaner, which leaves no residues on substrates or inside the equipment
Shows excellent material compatibility
Has no flash point and thus can be applied without explosion-proof protection
VOC value significantly below 20%, therefore easy to comply with local regulations on VOC emmissions
Non-foaming, low odor, no buildup of organics in the rinsing section

VIGON UC 160

High wetting ability for stencil underside wiping in printers

VIGON®UC 160 is a water-based cleaner specifically designed to remove solder paste from stencils in SMT printers. VIGON®UC 160 has an excellent wetting ability, which leads to an improved cleaning performance and thereby reduces smearing on the stencil underside significantly. This in turn prevents solder paste bridging on boards and ensures good and reliable printing results.

Effectively removes the latest lead-free & lead-based solder pastes from stencils in underside wiping even out of fine pitch apertures
The cleaner is specifically suitable for print after wait
Provides excellent wetting ability on stencils and therefore increased cleaning performance, which significantly reduces smearing on the stencil underside. Thus bridging of solder paste on the boards can be avoided
Good delineation stability further ensures reduced solder balling
High operational safety and ideal replacement for Isopropanol due to excellent health and safety characteristics, no flash point, low VOC levels
VIGON®UC 160 has low odor

ZESTRON SD 301

For the removal of solder pastes, SMT adhesives and thick film pastes

ZESTRON® SD 301 is an odor improved formulation. Especially a faster drying time allows for shorter cleaning processes. The solvent-based cleaner removes solder pastes, SMT adhesives as well as thick film pastes from stencils and screens in spray-in-air systems. Its high flash point permits both manual use and the application in printers and stencil cleaning equipment.

Wide process window
High loading capabilities, long bath life and therefore low cleaning costs
High flash point of 47° C / 117° F, can be used without external explosion-protection systems
Has a short overall process time
The cleaning medium is based on non-halogenated, organic solvents
Applicable at ambient cleaning temperature
Low odor as well as fast drying time

ZESTRON SW

For SMT stencil printer wipe systems

ZESTRON®SW is a solvent-based cleaner with a high flash point, which was specifically designed for the use in SMT printers without vacuum drying. ZESTRON®SW achieves reproducible cleaning results and dries residue-free, thus it increases the reliability of the printing process.

Due to its wide process window ZESTRON®SW reliably removes solder pastes from the stencil underside
Dries fast and residue-free on stencils after dry wipe
Good delineation stability and reduced solder balling
Unlike Isopropanol (flash point: 12°C/54°F) ZESTRON®SW (flash point: 67°C/153°F) dramatically increases operational safety while operating stencil printing equipment
Based on non-halogen, organic solvents
Biodegradable
Reduces the amount of cleaning cycles

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Stencil cleaning

NETWORKING IS GOOD -personal contact is better.

NETWORKING IS GOOD -
personal contact is better.