VIGON®A 250 is a water-based MPC®cleaning agent designed to remove flux residues and solder pastes from electronic assemblies and Power LEDs. Due to its mild formulation, VIGON®A 250 is especially suitable for longer exposure times.
VIGON®US is a water-based medium specifically developed for the use in ultrasonic, spray-under-immersion and centrifugal cleaning equipment. Based on MPC®Technology, VIGON®US removes all types of flux residues from electronic assemblies, Flip Chip Packages and CMOS.
VIGON®A 201 provides excellent cleaning performance in spray-in-air cleaning processes for the cleaning of capillary spaces, e.g. under low standoff components. It leads to shiny solder joints after cleaning without the need for any additives. Additionally, it is recommended for flux removal from Flip Chips, CMOS and Power LEDs.
VIGON®A 200 is a water-based cleaning medium specifically developed for the use in high and medium pressure spray equipment such as inline or batch equipment. Based on MPC®Technology, VIGON®A 200 removes all types of flux residues from electronic assemblies, ceramic hybrids, power modules and lead frames. VIGON®A 200 meets the highest cleanliness requirements for subsequent wire bonding and coating steps.
Water-based, pH-neutral cleaning agent developed for defluxing Power Electronics and PCBs in spray-in-air equipment. Reliably removes flux residues and provides excellent material compatibility. Can be used for defluxing of leadframes, discrete devices, power modules, power LEDs as well as PCBs with low-standoff components and features good deoxidation of copper surfaces.
VIGON®N 600 is an innovative defluxing product with a revolutionary pH-neutral formulation. Its excellent cleaning performance and ability to remove a wide range of flux residues under pH-neutral conditions is unprecedented. Due to its neutral pH-value, the cleaning agent also demonstrates a high level of material compatibility with sensitive metals and polymers on PCBs.
Solvent-based cleaning agent designed to remove all types of flux residues from electronic assemblies, ceramic hybrids, power electronics (power modules, leadframe-based discrete components, power LEDs) and packages (Flip Chips(CMOS). The product is characterized by its high cleaning performance and bath loading capability ensuring an extremely long bath life.
Solvent-based cleaning agent designed to remove flux residues from electronic assemblies, ceramic hybrids and leadframe-based discrete components in closed-loop, one chamber, vapor degreasing type systems.
VIGON®EFM is a precision cleaning agent designed to remove flux residues from electronic assemblies in manual applications. This product can also be used in explosion-proof spray-in-air equipment. VIGON®EFM is a mixture of halogen-free organic solvents. It dries fast and residue-free. VIGON®EFM is non-corrosive and compatible with most polymers.
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