This product was developed to achieve a drastic reduction in voiding in components with a large contact surface, such as power transistors, QFNs and, above all, automated applications. Anti-cushion effect formula. Powerful wetting. Guarantees consistent quality and performance during long-term use over several days. Very economical in its application. Halogen-free. The solder paste is suitable for superfine applications, MBGA, 0.4mmP QFP and QFN.
Today, the number of applications and types of PCB available for SMT have increased. The soldering conditions are adapted to suit the different surfaces and the quality of the base metal. Oxidised components are a huge problem as they cause a wide range of soldering defects. Ensures outstanding continual printability with super-fine pitch (0.4 mm/16 mil) and CSP applications (>0.3 mm dia.) for normal to fast printing and a long stencil lifetime. Powerful wetting of oxidised base plates and components, such as oxidised nickel. Ultimate solution for dewetting.
Solder alloy with low melting point (138°C). Replacing the SnAgCu alloy with this product can reduce C02 emissions by up to 40% thanks to the low melting point. Outstanding wetting and low voiding. Halogen-free (Br ≤ 900 ppm, Cl ≤ 900 ppm, Br + CI ≤ 1500 ppm). TB48-M742D is suitable for dosing systems.
A very small quantity of two modified elements, Bi and Ni, are added. Different effects produced by these elements have been combined to achieve a powerful and easy-to-use low-Ag solder that is equal to or superior to SAC305 in terms of its melting point, thermal durability and crystal structure deformation over time.
A very small quantity of two modified elements, Bi and Ni, are added. The different effects of these elements have combined to achieve a powerful and easy-to-use low-Ag solder that is equal to or superior to SAC305 in terms of its melting point, thermal durability and crystal structure deformation over time.
In order to span the activation temperature range and resolve concerns in terms of the activation continuity and heat resistance, several activators have been encapsulated and effectively mixed. As activation is slowed down at room temperature, it has been possible to stabilise the viscosity for the print result with few deviations.
SAC-type solder joints are not suitable for a longer product lifetime for applications that are exposed to significantly higher temperatures. In order to enable a much stronger, fatigue-resistant joint, In and Bi are added to facilitate a solid solution for the Sn crystal matrix.
Graping often occurs during the use of fine-particle solder paste because the higher volume of fine particles printed leads to an increase in oxide layers. S3X70-M500D minimises the quantity of oxide layers by selecting finer and more spherical solder powder under strict quality controls, to ensure high fusibility.
The non-contact application of solder paste enables repeated separation at a certain point. The quantity of solder paste can be set according to the size and therefore ensures the solder is ultra-reliable.